Special Issue: "ISNNM 2022 - Integrated Computer-aided Process Engineering"

The editorial committee of Materials Transactions is planning to publish a special issue on “Integrated Computer-Aided Process Engineering” as August 2023 (changed to September 2023).
The committee would like to invite many contributions of original articles from around the globe for this special issue.

Objective and topics of coverage are as follows:

This special issue belongs to the sections of "Computer-aided Materials Engineering (CME)” and “Integrated Computer-aided Process Engineering (ICAPE)” in International Symposium on Novel and Nano Materials (ISNNM 2022), held at Jeju in South Korea (Nov 14 – 18, 2022). From new materials development to commercialization, the most time/cost-consuming step is the migration of a process from the lab-scale to the pilot plant or commercial scale. Despite decades-long endeavors to describe material behavior during manufacturing processes, simulations of nano-meso-macro scale “microstructural evolution” of materials under various processing circumstances have less been attended than continuum mechanics modeling to describe circumstances experienced by the materials. This special issue will address recent advances in scale-bridging simulations and characterization to understand, describe, and predict the microstructure-property relationship of newly developed materials in a lab to industrial-level processes. In general, multiple physical phenomena simultaneously take place during manufacturing, such as heat transfer, fluid flow, phase transformation, microstructural evolution, such as grain refinement, and elastic/plastic deformations under static and dynamic loadings, e.g., nanoindentation, severe plastic deformation, superplasticity, shock, metal 3d printing, etc. Hence, integration of multi-physics material simulation models of multiple length scales is essential to capture the process-structures-properties relations of materials during manufacturing. This special issue will bring together detailed analysis, characterization as well as computational modeling of materials from atomistic to macroscopic length scales. This special issue will also cover process optimization techniques such as artificial intelligence (AI), response surface methodology (RSM), and design of experiments (DOE).

Topics:

density-function theory, molecular dynamics, dislocation dynamics, phase field modeling, crystal plasticity, finite element simulation, multi-scale materials modeling, multi-scale materials characterization, process-structure-property relationship, design of experiments, metal processing: severe plastic deformation,; superplasticity; metal 3D printing; thermo-mechanical processing, machine learning and artificial intelligence, applications in structural, energy, and smart/IT systems

Manuscripts due: February 1, 2023 (changed to March 1, 2023)

Editorial Committee of Materials Transactions
1-14-32, Ichibancho, Aoba-ku, Sendai 980-8544, Japan
Submission: E-mail: sadoku[a]jimm.jp